Warm water peelable epoxy adhesive "NIC BOND NB10000"
Easy to peel off in 30 minutes in warm water (60-80℃)! Reduces damage to parts, materials, and equipment.
The warm water peelable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily peeled off with warm water at temperatures between 60°C and 80°C. It is an epoxy-based adhesive that cures at room temperature to low temperatures, and after curing, it has adhesive strength equivalent to that of standard epoxy resin adhesives. It is expected to be useful for temporary bonding applications during the processing of materials that are difficult to peel off after bonding, such as "silicone ingots, sapphire, glass, neodymium-based magnetic materials, and semiconductors." 【Features】 ■ Cures at room temperature ■ High strength epoxy adhesive ■ Peels off in warm water (60-80°C) in 30 minutes ■ Does not use lactic acid, alkaline acids, or other chemicals *For more details, please refer to the catalog or feel free to contact us.
- Company：ダイゾー ニチモリ事業部
- Price：Other
